Flatpack soldering to solder-leveled printed wiring boards. Final report
A suitable manufacturing process was developed to solder multilead flatpacks to solder-leveled printed wiring boards (pwb). Additional solder required on the solder-leveled boards was supplied by solder preforms applied to each lead. These preforms contain the proper amount of solder to prevent bridging between flatpack leads or pwb solder pads. This process is slightly more time consuming than the conventional method of mounting flatpacks on unleveled tin/lead-plated boards by reflow soldering, but the increased cost is more than offset by the improved appearance and strength of the solder joints and by the improved solderability of solder-leveled boards as compared to that of unleveled tin/leadplated boards after typical storage periods. (auth)
- Research Organization:
- Bendix Corp., Kansas City, Mo. (USA)
- NSA Number:
- NSA-29-015102
- OSTI ID:
- 4366158
- Report Number(s):
- BDX--613-839(Rev.)
- Country of Publication:
- United States
- Language:
- English
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