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Electronic transport and microstructure in molybdenum silicide thin films

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.92632· OSTI ID:5951515
Electronic transport and microstructure were investigated in molybdenum silicide thin films prepared by ion beam sputtering from a MoSi/sub 2/ powder source. Auger and x-ray analysis of the as-deposited films indicated a gross Mo/Si atomic ratio of approx.1/2, but a probable microstructure of strongly oriented Mo/sub 5/Si/sub 3/ crystallites in a Si-rich amorphous matrix. High-temperature annealing reduced the room-temperature resistivity by almost an order of magnitude, changed the sign of the temperature coefficient from negative to positive, and increased the Hall coefficient. The annealing also apparently increased the volume fraction of the film occupied by the oriented Mo/sub 5/Si/sub 3/ phase. It is shown that detailed transport data is needed for correctly evaluating the potential of refractory metal silicides as an improved gate electrode and interconnection material for integrated circuits.
Research Organization:
Department of Electrical Engineering, Colorado State University, Fort Collins, Colorado 80523
OSTI ID:
5951515
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 39:12; ISSN APPLA
Country of Publication:
United States
Language:
English