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A study of the effects of processing on the response of implanted buried oxides to total dose irradiation

Conference · · IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (USA)
OSTI ID:5933562
;  [1];  [2]
  1. Florida Univ., Gainesville, FL (USA). Dept. of Electrical Engineering
  2. Ibis Technology, Danvers, MA (US)

The SOI (silicon-on-insulator) approach to radiation-hardened circuits has significant advantages over bulk designs. However, the buried insulator layer presents an additional challenge for total dose hardening. For SOI materials formed by oxygen implantation (the SIMOX method), the charge trapping properties of the buried oxide layer are of particular interest, since few radiation studies have been performed on this material. In this study, the authors investigate the effects of changing the dose of the oxygen implant and the temperature and time of the post-implant anneal. They find a trend toward reduced charge trapping for samples with longer or higher temperature anneals. The density of trapped charge is insensitive to changes in the implant dose. However, for low implant doses, a large (4--8 {times} 10{sup 16} cm{sup {minus}3}) increase is seen in the film donor density with irradiation. Furthermore, a trend is seen for increased charge trapping for samples with higher initial fixed oxide charge. Finally, charge trapping at the substrate/buried oxide interface is insensitive to processing.

OSTI ID:
5933562
Report Number(s):
CONF-900723--
Journal Information:
IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (USA), Journal Name: IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (USA) Vol. 37:6; ISSN 0018-9499; ISSN IETNA
Country of Publication:
United States
Language:
English