Gamma-ray irradiation effects on VLSI geometry MOSFETs fabricated on laser recrystallized SOI wafers
The authors have investigated the effects of radiation on the characteristics of NMOS and PMOS FETs having different channel length (1.3 ..mu.. m - 5 ..mu.. m). The FETs were fabricated on SOI wafers where the silicon (0.5 ..mu.. m) film was laser recrystallized. Gammairradiation (up to 200 Krad(Si)) was performed at 300 K while the devices were under bias (+10, 0, -10 volts). Radiation produced severe increases in the NMOS FETs subthreshold leakage currents. Smaller increases with irradiation were observed in the PMOS FET/sup 0/s subthreshold leakage currents. Radiation caused increases in the PMOS FET/sup 0/s threshold voltage with the largest shifts occuring for the +10 volts gate bias. The threshold voltage in NMOS devices decreased with exposure to ionizing irradiation. All the observed threshold shifts are consistent with net hole trapping in the SiO/sub 2/. The authors observed a monotonic dependence of the radiation induced threshold voltage shifts on the channel length of PMOS devices. Smaller threshold shifts were obtained for the shorter channel devices.
- Research Organization:
- Westinghouse Electric Corp., Advanced Technology Labs., P.O.B. 1521 MS 3531, Baltimore, MD 21205
- OSTI ID:
- 5922155
- Journal Information:
- IEEE Trans. Nucl. Sci.; (United States), Journal Name: IEEE Trans. Nucl. Sci.; (United States) Vol. 29:6; ISSN IETNA
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
Instruments
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46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY
CHALCOGENIDES
CURRENTS
DOSES
ELECTRIC CURRENTS
ELECTROMAGNETIC RADIATION
FABRICATION
FIELD EFFECT TRANSISTORS
GAMMA RADIATION
GEOMETRY
IONIZING RADIATIONS
IRRADIATION
LASERS
LEAKAGE CURRENT
MATHEMATICS
MOS TRANSISTORS
MOSFET
OXIDES
OXYGEN COMPOUNDS
RADIATION DOSES
RADIATION EFFECTS
RADIATIONS
RECRYSTALLIZATION
SEMICONDUCTOR DEVICES
SILICON COMPOUNDS
SILICON OXIDES
THRESHOLD DOSE
TRANSISTORS