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Ion beam annealing of Ga-implanted Si

Conference ·
OSTI ID:5892255
Rutherford backscattering/ion channeling and transmission electron microscopy have been used to investigate regrowth effects which occur during high-energy ion bombardment of amorphous silicon layers implanted with 1 /times/ 10/sup 16/ Ga/cm/sup 2/. At both 300 and 400/degree/C the Si lattice initially regrows epitaxially. However, at this high dopant level, Ga is segregated at the crystalline-amorphous interface and eventually disrupts epitaxy. Transmission electron microscopy had been used to characterize the lattice morphology and monitor movement of the Ga. The results are compared with thermal annealing effects in Ga-implanted Si samples. 15 refs., 4 figs.
Research Organization:
Oak Ridge National Lab., TN (USA)
DOE Contract Number:
AC05-84OR21400
OSTI ID:
5892255
Report Number(s):
CONF-890579-1; ON: DE89016857
Country of Publication:
United States
Language:
English