Nb/AlO sub x /Nb trilayer process for the fabrication of submicron Josephson junctions and low-noise dc SQUIDs

Journal Article · Mon Mar 25 04:00:00 EST 1991 · Applied Physics Letters; (USA)

DOI:https://doi.org/10.1063/1.104298· OSTI ID:5883929

Bhushan, M; Macedo, E M ^[1]

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1. Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173 (US)

A trilayer deposition process for making high quality all-refractory Nb/AlO{sub {ital x}}/Nb Josephson junctions is described. The sputtering parameters were optimized to deposit very uniform Al films, less than 5 nm in thickness. We found that it was essential to keep the substrate temperature below 40 {degree}C during Al deposition but not during Nb depositions. Rapid anodization of the Nb counterelectrode allowed us to use positive photoresist as an anodization mask even for submicron geometries. The dc superconducting quantum interference devices made with this process have the lowest intrinsic energy sensitivity reported to date for an all-refractory technology.

• OSTI ID: 5883929
• Journal Information: Applied Physics Letters; (USA), Journal Name: Applied Physics Letters; (USA) Vol. 58:12; ISSN APPLA; ISSN 0003-6951
• Country of Publication: United States
• Language: English

Related Subjects

426001* -- Engineering-- Superconducting Devices & Circuits-- (1990-)
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ALUMINIUM COMPOUNDS
ALUMINIUM OXIDES
ANODIZATION
CHALCOGENIDES
CHEMICAL COATING
CORROSION PROTECTION
DEPOSITION
DESIGN
ELECTROCHEMICAL COATING
ELECTROLYSIS
ELECTRONIC EQUIPMENT
ELEMENTS
EQUIPMENT
FABRICATION
FILMS
FLUXMETERS
JOSEPHSON JUNCTIONS
JUNCTIONS
LYSIS
MEASURING INSTRUMENTS
METALS
MICROWAVE EQUIPMENT
NIOBIUM
OXIDES
OXYGEN COMPOUNDS
SQUID DEVICES
SUPERCONDUCTING DEVICES
SUPERCONDUCTING FILMS
SUPERCONDUCTING JUNCTIONS
SURFACE COATING
THIN FILMS
TRANSITION ELEMENTS