Enhancing adhesion between thin metal films and polyimide substrate by Ar sup + irradiation

Miscellaneous · Sun Jan 01 00:00:00 EST 1989

OSTI ID:5880636

Koh, S K

Ar{sup +} irradiation and heat treatment were used to improve the adhesion between deposited thin Copper or Chromium film (400{angstrom}) and polyimide substrate. Ar{sup +} at 200 keV and the dose between 10{sup 13} to 4 {times} 10{sup 16} ions/cm{sup 2} were used. The heat treatment has been carried out at 150, 200, 250{degree}C up to 25 hours. The surface analyses were made with RBS, FTIR, XPS, X-ray diffraction, SEM and Optical microscopy. The RBS showed that Cu particles diffused into the polyimide substrate during the Ar{sup +} irradiation and/or heat treatment, bu Cr particles diffused into the substrate during the Ar{sup +} irradiation only. The X-ray diffraction showed that the Cu film crystallized during the Ar{sup +} irradiation and the heat treatment, but the Cr film remained amorphous during the same treatments. Thermal fatigue test and the abrasive wear test were used to determine changes in the relative adhesion strength between the Cu or Cr film and PI substrate. The thin film wear resistance of Cu/PI and Cr/PI systems were explained by means of the crystallinity of the thin film, mixing amounts at the interface, damage of the substrate, and the adhesion between the metal and polyimide. FTIR and XPS have been used to study the formation of the metal/polyimide interface at various doses of Ar{sup +} ions. The thickness of the metal was fixed at 50 {angstrom} and the Ar{sup +} doses received by samples were varied from 1 {times} 10{sup 14} to 1 {times} 10{sup 16} ions/cm{sup 2} at 50 keV for the XPS experiment. For the FTIR experiment, 200 keV was chosen for 400 {angstrom} thick Cr film which was evaporated on PI/KBr cell. The carbon and oxygen 1s spectra underwent considerable changes due to the Ar{sup +} irradiation, indicating possible new bond formation.

• Research Organization: Rutgers-the State Univ., New Brunswick, NJ (USA)
• OSTI ID: 5880636
• Resource Relation: Other Information: Thesis (Ph. D.)
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
CHROMIUM
PHYSICAL RADIATION EFFECTS
COPPER
POLYMERS
ADHESION
AMORPHOUS STATE
ARGON IONS
CHEMICAL BONDS
CHEMICAL REACTIONS
CRYSTALLIZATION
DIFFUSION
HEAT TREATMENTS
IMIDES
INTERFACES
SUBSTRATES
THERMAL FATIGUE
THIN FILMS
WEAR
WEAR RESISTANCE
X-RAY DIFFRACTION
CHARGED PARTICLES
COHERENT SCATTERING
DIFFRACTION
ELEMENTS
FATIGUE
FILMS
IONS
MECHANICAL PROPERTIES
METALS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
PHASE TRANSFORMATIONS
RADIATION EFFECTS
SCATTERING
TRANSITION ELEMENTS
360106* - Metals & Alloys- Radiation Effects
360605 - Materials- Radiation Effects