Adhesion enhancement of ion beam mixed Cu/Al/polyimide
- Department of Physics, Yonsei University, Seoul 120-749 (Korea)
- Department of Physics, Chonnam National University, Kwangju 500-757 (Korea)
- Department of Physics, Sunmoon University, Asan 336-840 (Korea)
Cu (400 {Angstrom})/polyimide was mixed with 80 keV Ar{sup +} and N{sub 2}{sup +} from 1.0{times}10{sup 15} to 2.0{times}10{sup 16} ions/cm{sup 2}. The same processes were repeated for the Cu (400 {Angstrom})/Al (50 {Angstrom})/polyimide system which has Al as a buffer layer. The quantitative adhesion strength was measured by a standard scratch test. X-ray photoelectron spectroscopy was employed to investigate the change in the chemical bonds of the ion beam mixed polyimide substrate and the intermediate effects for the adhesion enhancement in Cu/Al/polyimide. Two distinct tendencies are observed in the adhesion strength: Cu/Al/polyimide is more adhesive than Cu/polyimide after ion beam mixing, and N{sub 2}{sup +} ions are more effective in the adhesion enhancement than Ar{sup +}. The formation of an interlayer compound of CuAl{sub 2}O{sub 4} accounts for the former, while the latter is understood by the fact that N{sub 2}{sup +} ions produce more pyridinelike moiety, amide group and tertiary amine moiety which are known as adhesion promoters. {copyright} {ital 1997 American Institute of Physics.}
- OSTI ID:
- 435097
- Journal Information:
- Journal of Applied Physics, Journal Name: Journal of Applied Physics Journal Issue: 1 Vol. 81; ISSN JAPIAU; ISSN 0021-8979
- Country of Publication:
- United States
- Language:
- English
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