Hermetically sealed microminiature multisocket connector

Conference · Sat Jan 01 04:00:00 EST 1983

OSTI ID:5858827

Konnick, P. J.

A unique hermetic microminiature multisocket connector was designed at Sandia as a means of interfacing with a sealed component package in a weapon system to ensure a controlled environment. Such a capability had not previously been available on any existing connector of comparable size and contact density. The connector is characterized by glass sealing of a high-density contact pattern, a weldable mounting flange, and by microminiature size. This glass-to-metal sealing method, using individual glass beads, requires 51 holes on 50-mil centers in the web portion of the shell. As an alternative to the glass-to-metal method, the connector contacts and shell were redesigned for compatability with ceramic-to-metal sealing techniques. In this potentially lower cost, higher yield method, the metal web of the shell is replaced with a ceramic web containing 51 metallized holes on 50-mil centers. This report presents the design requirements for the hermetic microminiature multisocket connector; describes its physical and electricl characteristics; traces the testing and evaluation program as developed and evaluated by Sandia National Laboratories with the support of ITT Canon Electric Division of Phoenix, AZ; and describes the electrical and environmental test program performed by Bendix Corporation of Kansas City, MO.

• Research Organization: Sandia National Labs., Albuquerque, NM (USA)
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 5858827
• Report Number(s): SAND-83-0665C; CONF-831182-1; ON: DE83017484
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
CABLES
COMPATIBILITY
CONDUCTOR DEVICES
CONNECTORS
DESIGN
ELECTRIC CABLES
ELECTRICAL EQUIPMENT
EQUIPMENT
FLANGES
GLASS
PERFORMANCE TESTING
TESTING