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Development of Hermetic Microminiature Connectors

Conference · · Journal of Electronic Packaging
DOI:https://doi.org/10.1115/1.2905427· OSTI ID:6611304
 [1];  [1];  [1];  [1]
  1. Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

Miniaturization of hermetic packages has provided the incentive to develop a new family of hermetic microminiature connectors. Microminiature connectors, with a pin spacing of 1.27 mm, have previously been available only in the nonhermetic form. New microminiature connectors with compression seal materials, 304 Stainless Steel housings, Alloy 52 pins, and TM-9 Glass insulators, were examined because compression seals are currently used in larger hermetic connectors and are typically designed to create a residual compressive stress state in the insulator during manufacturing. The new microminiature connectors with compression seals were evaluated analytically with two and three-dimensional finite element models and experimentally by fabrication of prototype connectors. The finite element analyses predicted the development of undesirable tensile stress in the insulator during manufacture and identified the mechanism responsible for the generation of tensile stress in the glass. The experimental investigation confirmed the existence of undesirable tensile stress in the glass with the observation of crack development during manufacture. Since the design requirements would not allow the geometric modifications needed to manufacture crack-free connectors with compression seals, insulator materials that generate a matched seal with 304 Stainless Steel housing were developed. Connectors with these matched seals were successfully manufactured.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE Office of Defense Programs (DP)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6611304
Report Number(s):
SAND--90-0650C; CONF-901109--16; ON: DE90015562
Journal Information:
Journal of Electronic Packaging, Journal Name: Journal of Electronic Packaging Journal Issue: 4 Vol. 113; ISSN 1043-7398
Publisher:
ASME
Country of Publication:
United States
Language:
English