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Oxidation of hydrogen doped tantalum films on silicon

Journal Article · · J. Vac. Sci. Technol., B; (United States)
DOI:https://doi.org/10.1116/1.583602· OSTI ID:5851745
Hydrogen doping of Ta films before thermal oxidation affects the dc leakage current in oxidized Ta films. Metal-insulator-semiconductor (MIS) capacitors of Al/Ta/sub 2/O/sub 5/ (40 nm thick)/Si-substrate structures have been prepared for the electrical measurements. The Ta films were reactively sputtered on p-type Si substrates in a mixture of Ar and H/sub 2/ gases suitable for hydrogen doping. The hydrogen doping was found to be effective in reducing the leakage current in the Ta/sub 2/O/sub 5/ films to be less than 10/sup -3/ times that of undoped films, especially after low temperature oxidation at 400 /sup 0/C. Secondary ion mass spectrometry (SIMS) analysis showed that the incorporation in the Ta/sub 2/O/sub 5/ films of Si from the substrate was decreased by the presence of hydrogen during sputtering. A possible explanation for the reduction of leakage current caused by hydrogen doping is that the prevention of Si entry into Ta/sub 2/O/sub 5/ films reduces the density of oxygen vacancies induced by unsaturated SiO/sub x/(x<2). This is thought to suppress the Poole--Frenkel-type conduction in the Ta/sub 2/O/sub 5/ films.
Research Organization:
NTT Atsugi Electrical Communication Laboratories, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa Prefecture, 243-01 Japan
OSTI ID:
5851745
Journal Information:
J. Vac. Sci. Technol., B; (United States), Journal Name: J. Vac. Sci. Technol., B; (United States) Vol. 4:3; ISSN JVTBD
Country of Publication:
United States
Language:
English