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U.S. Department of Energy
Office of Scientific and Technical Information

Silicon-sheet surface studies

Technical Report ·
OSTI ID:5845386

The nondestructive determination of residual stresses in short sections of sheet silicon is discussed. A laser interferometry technique for polished surfaces a shadow Moire technique, for rough surfaces, to determine deflections in sheet silicon and an analysis of extracting residual stresses from measured deflections of circular wafers and short rectangular wafers are discussed.

Research Organization:
Illinois Univ., Chicago (USA)
OSTI ID:
5845386
Report Number(s):
N-85-15287
Country of Publication:
United States
Language:
English

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