Field-assisted bonding of single crystal quartz
A technique to produce strong, hermetic bonds between plates of single crystal quartz using a modified field-assisted bonding process is presented. Field-assisted bonding is a technique traditionally used to join glass to metals at temperatures well below normal glass softening temperatures. To promote reactivity between quartz within an electrical field at temperatures well below quartz transformation temperatures, thin films of silicon metal and glass were vapor deposited onto adjacent quartz plates. Thermal stresses caused by expansion mismatch between the quartz and the films were of concern. These stresses were reduced by determining the minimum film thicknesses capable of yielding sufficient reactivity for bonding. Processing studies were conducted to optimize bond integrity, and bonds were characterized by hermeticity, thermal shock, and mechanical shock. Packages produced under the most ideal conditions were able to survive greater than 1000 psi shock loads. 11 refs., 10 figs., 3 tabs.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (USA)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 5828069
- Report Number(s):
- SAND-89-0814C; CONF-8908132-1; ON: DE89015407
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
360601* -- Other Materials-- Preparation & Manufacture
BONDING
CHALCOGENIDES
CRYSTALS
DIMENSIONS
ELECTRIC FIELDS
ELEMENTS
FABRICATION
FILMS
GLASS
IMPACT SHOCK
JOINING
METALS
MINERALS
OXIDE MINERALS
OXIDES
OXYGEN COMPOUNDS
QUARTZ
SEMIMETALS
SHEAR
SILICON
SILICON COMPOUNDS
SILICON OXIDES
THERMAL SHOCK
THICKNESS
THIN FILMS