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Masking considerations in chemically assisted ion beam etching of GaAs/AlGaAs laser structures

Journal Article · · J. Electrochem. Soc.; (United States)
DOI:https://doi.org/10.1149/1.2096742· OSTI ID:5777295
The use of photoresist, Cr, and SiO/sub 2/ as etch masks for GaAs/AlGaAs structures in chemically assisted ion beam etching is reported. The optimized etch with a photoresist mask results in a high degree of anisotropy and smooth sidewalls. However, the etched surface contains undesirable features. The etch with a Cr mask is also highly anisotropic, and the etched surface is free of features. The drawback with Cr masks is that the sidewalls are rough. Vertical and smooth sidewalls as well as a featureless surface are obtained with a SiO/sub 2/ mask. The SiO/sub 2/ mask has been employed to etch the facets of monolithic GaAs/AlGaAs-based laser structures.
Research Organization:
Cornell Univ., Ithaca, NY (USA). School of Electrical Engineering; Cornell Univ., Ithaca, NY (USA). School of Applied and Engineering Physics
OSTI ID:
5777295
Journal Information:
J. Electrochem. Soc.; (United States), Journal Name: J. Electrochem. Soc.; (United States) Vol. 136:3; ISSN JESOA
Country of Publication:
United States
Language:
English