Step-edge fabrication of ultrasmall Josephson microbridges

Journal Article · Fri Feb 01 04:00:00 EST 1980 · Appl. Phys. Lett.; (United States)

DOI:https://doi.org/10.1063/1.91434· OSTI ID:5772111

Feuer, M D; Prober, D E

A technique for producing ultrasmall variable-thickness Josephson microbridges for high-frequency applications is described. A two-dimensional shadowing technique is employed with self-aligning photolithographic and reactive-ion milling processes to pattern the substrate with high-resolution steps. Step heights normal to the substrate are used to determine microbridge dimensions. Lead-alloy microbridges with resistances approx. =10 ..cap omega.. and dimensions of 50 nm have been produced, and their electrical properties studied. The limits on device size are in the range 10--20 nm. Heated-substrate deposition of high-T/sub c/ superconductors is compatible with this technique.

• Research Organization: Becton Center, Department of Engineering and Applied Science, Yale University, New Haven, Connecticut 06520
• OSTI ID: 5772111
• Journal Information: Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 36:3; ISSN APPLA
• Country of Publication: United States
• Language: English

Related Subjects

420201* -- Engineering-- Cryogenic Equipment & Devices
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
ALLOYS
DEPOSITION
DIMENSIONS
ELECTRIC BRIDGES
ELECTRICAL EQUIPMENT
ELECTRICAL PROPERTIES
EQUIPMENT
FABRICATION
JOSEPHSON JUNCTIONS
LEAD ALLOYS
PHYSICAL PROPERTIES
RESOLUTION
SUBSTRATES
SUPERCONDUCTING JUNCTIONS
SUPERCONDUCTORS
THERMODYNAMIC PROPERTIES
THICKNESS
TRANSITION TEMPERATURE