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Thermal stability of electrically active dopants in laser annealed silicon films

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.332768· OSTI ID:5728986
Single crystal Si wafers and polycrystalline Si films on Si/sub 3/N/sub 4/ have been implanted with large doses (1 x 10/sup 15//cm/sup 2/--4 x 10/sup 16//cm/sup 2/) of P or As and laser annealed with either a cw or pulsed laser. The samples were then subjected to thermal anneals between 450 and 900 /sup 0/C to determine the thermally stable dopant concentration for each sample. Sheet resistance and Hall measurements have been used to measure the electrical properties in each case. SIMS, RBS, and TEM have been used to measure atomic profiles, As substitutionality and residual defects after laser and thermal annealing. In each case the maximum electrically active dopant concentration achieved by laser annealing decreased after a 700--800 /sup 0/C thermal anneal.
Research Organization:
Semiconductor Research and Development Laboratories, Motorola, Incorporated, 5005 E. McDowell Road, Phoenix, Arizona 85008
DOE Contract Number:
W-7405-ENG-26
OSTI ID:
5728986
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 54:9; ISSN JAPIA
Country of Publication:
United States
Language:
English