High temperature, bonded titanium diboride sputter target

Technical Report · Thu Oct 01 04:00:00 EDT 1981

OSTI ID:5726307

Hale, G J; Gates, W G

A high-temperature bonding technique has been employed in the development of an improved sputter deposition target for hard, crack-prone materials such as titanium diboride (TiB/sub 2/). Titanium diboride was bonded to a thin metal backing plate, both materials having a similar linear coefficient of thermal expansion (LCTE) using a high-temperature braze alloy. The thin metal backing plate helps stabilize the movement of the target material during the sputter deposition operation. The bonded sputter target has a useable life of 50 to 75 times that of a unbonded target. This bonding technique may be used on a variety of hard, brittle, crack-prone, sputterable materials (including metal oxides, carbides borides, and nitrides). US Patent 4,209,375 has been issued as a result of this endeavor.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 5726307
• Report Number(s): BDX-613-2661; ON: DE82002687
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360201* -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
BONDING
BORIDES
BORON COMPOUNDS
DEPOSITION
FABRICATION
HARD FACING
JOINING
MECHANICAL PROPERTIES
MECHANICAL STRUCTURES
SPUTTERING
SUPPORTS
TARGETS
TITANIUM BORIDES
TITANIUM COMPOUNDS
TRANSITION ELEMENT COMPOUNDS
WEAR RESISTANCE