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Field dependence of interface-trap buildup in polysilicon and metal gate MOS devices

Conference · · IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (USA)
DOI:https://doi.org/10.1109/23.101171· OSTI ID:5722211
; ; ; ;  [1];  [2]
  1. Sandia National Labs., Albuquerque, NM (USA)
  2. L and M Technologies, Albuquerque, NM (US)

The electric field dependence of radiation-induced interface- and oxide-trap charge ({Delta}V{sub ot} and {Delta}V{sub it}) generation for polysilicon- and metal-gate MOS transistors is investigated at electric fields (E{sub ox)} from {minus} 4.2 MV/cm to + 4.7 MV/cm. If electron-hole recombination effects are taken into account, the absolute value of {Delta}V{sub ot} and the saturated value of {Delta}V{sub it} for both polysilicon- and metal-gate transistors are shown to follow an approximate E{sup {minus} 1/2} field dependence for E{sub ox} {>=} 0.4 MV/cm. An E{sup {minus} 1/2} dependence for the saturated value of {Delta}V{sub it} was al;so observed for negative-bias irradiation followed by a constant positive-bias anneal.

DOE Contract Number:
AC04-76DP00789
OSTI ID:
5722211
Report Number(s):
CONF-900723--
Journal Information:
IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (USA), Journal Name: IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (USA) Vol. 37:6; ISSN 0018-9499; ISSN IETNA
Country of Publication:
United States
Language:
English