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U.S. Department of Energy
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{sup 15}N hydrogen profiling of IC metallizations

Conference ·
OSTI ID:57154

The 6.4 MeV p({sup l5}N,{alpha}{gamma}){sup 12}C resonant nuclear reaction has been used to investigate the role of hydrogen as a contributing factor in the formation of stress-induced voids in very large scale integrated circuit metallizations. Hydrogen profiles were measured from a series of layered structures consisting of aluminum-copper alloy metallizations deposited on borophosphosilicate glass and capped with a variety of commercial passivation materials in order to examine differences in the concentrations and depth distributions of hydrogen within the layered structures.

Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
57154
Report Number(s):
SAND--95-0762C; CONF-950220--9; ON: DE95011052
Country of Publication:
United States
Language:
English