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U.S. Department of Energy
Office of Scientific and Technical Information

Radiation effects hardening techniques

Conference ·
OSTI ID:5648018

This section of the IEEE Tutorial Short Course will discuss techniques for radiation hardening semiconductor electronic components. The hardening techniques may include special process procedures and constraints, circuit designs, and system adaptations to achieve the desired level of radiation tolerance. The radiation sources considered include nuclear weapons, natural space environments, and nuclear reactors. Each of these sources offers a unique radiation spectrum requiring specific hardening techniques for the semiconductor technologies used and, equally important, specific testing procedures to verify that the desired radiation tolerance level has been achieved with confidence. The radiation spectrum for the various sources will be reviewed, with its particular characteristics. 39 refs., 32 figs.

Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
5648018
Report Number(s):
SAND-85-0742C; CONF-850711-11; ON: DE85009813
Country of Publication:
United States
Language:
English