Thin film network test pattern for use with electroplated gold

Conference · Sun Nov 01 04:00:00 EST 1981

OSTI ID:5582180

Hines, R A

A test pattern was developed to monitor the quality of pattern electroplated gold thin-film networks (TFNs). A Ti/Pd/pattern electroplated Au metallization system is replacing the current Bendix Kansas City production evaporated Cr/Au system. The monitor retains the most useful features of its predecessor and adds several new patterns for the electrical measurement of resolution, gold thickness, and conductor width. Each 0.25 by 1 in. monitor contains standard and checkerboard thermal compression lead frame bond pads and 18 electrical test patterns. Pattern electroplating was used to make a conductor for 4-point resistance measurements on the monitor and a microcomputer based tester is being assembled to measure and reduce the resistance data.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 5582180
• Report Number(s): BDX-613-2712; CONF-820214-1; ON: DE82010728
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
BONDING
CHROMIUM
COATINGS
CONTROL
DIMENSIONS
ELECTRIC CONDUCTIVITY
ELECTRIC CONTACTS
ELECTRICAL EQUIPMENT
ELECTRICAL PROPERTIES
ELECTRODEPOSITED COATINGS
ELECTRONIC CIRCUITS
ELEMENTS
EQUIPMENT
FABRICATION
GOLD
JOINING
METALS
MICROELECTRONIC CIRCUITS
PHYSICAL PROPERTIES
PRODUCTION
QUALITY CONTROL
THICKNESS
TRANSITION ELEMENTS