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Title: Aqueous dryfilm photoresist for thin film network pattern gold electroplating

Conference ·
OSTI ID:5287194

An aqueous dryfilm photoresist was evaluated and selected to replace a solvent based resist for pattern gold electroplating of thin film networks. The aqueous resist not only eliminated solvents from the process but also improved resolution, line width control, and underplating of the resist. The new resist has been used to make TFNs with narrow lines and spaces that could not be made with the old resist. The adhesion of the new resist has produced excellent results on sapphire substrates allowing a low yield TFN, made with an etchback process on evaporated gold, to be coverted to pattern electroplated gold. In contrast with prior positive dryfilm results where snap back'' caused voids around vias, via resistance has been excellent. 1 ref., 1 fig., 3 tabs.

Research Organization:
Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
Sponsoring Organization:
USDOE; USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-76DP00613
OSTI ID:
5287194
Report Number(s):
KCP-613-4673; CONF-9109259-7; ON: DE92000463
Resource Relation:
Conference: 1. international congress on environmentally conscious manufacturing, Santa Fe, NM (United States), 18 Sep 1991
Country of Publication:
United States
Language:
English