Microstructural characterization of solders and brazes for advanced packaging technology
Historically, the electronics industry has always attempted to increase the speed of electronic components and decrease the size of electronic assemblies by developing and manufacturing smaller and faster basic level components (e.g., integrated circuits). However, it is now becoming apparent that the next significant advancement in electronic assembly size and speed may come not as a result of smaller and faster devices, but rather as a consequence of smaller and more closely spaced packages. This increased packaging density will occur at early levels of assembly as industry moves towards multichip modules. It will also occur at later packaging steps as industry continues to expand the use of surface mount technology (SMT) and mixed mounting technology (through hole attachment as well as SMT on one circuit board). Furthermore, there will be an increased propensity to use higher packaging density on printed wiring boards (PWB) and to place more PWB's in a given volume at yet the next level of packaging. One class of materials on which this advanced packaging technology will place severe new demands will be the alloys used to join assemblies and subassemblies (e.g. solders and brazes). These materials will be taxed both from the perspective of enhanced manufacturability as well as greater in-service robustness. It is the objective of this paper, through the use of selected case studies, to illustrate how advanced microstructural characterization techniques can be used to improve packaging technology. The specific case studies discussed are: (1) Microstructural Characterization of Solders, (2) Microstructural Characterization of Solder Joint Embrittlement of Leaded, Surface Mount Transistors (3) Microstructural Characterization of Metal/Ceramic Brazes in Electronic Applications, and (4) Microstructural Characterization of Direct Brazing of Graphite to Copper. 25 refs., 16 figs.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (USA)
- Sponsoring Organization:
- DOE; USDOE, Washington, DC (USA)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 5533596
- Report Number(s):
- SAND-91-0698C; CONF-910870--13; CONF-910872--5; ON: DE91011503
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
360101 -- Metals & Alloys-- Preparation & Fabrication
360102* -- Metals & Alloys-- Structure & Phase Studies
42 ENGINEERING
426000 -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
ALLOYS
ALUMINIUM COMPOUNDS
ALUMINIUM OXIDES
AUSTENITIC STEELS
BRAZED JOINTS
BRAZING
CARBON
CERAMICS
CHALCOGENIDES
CHROMIUM ALLOYS
CHROMIUM-NICKEL STEELS
CHROMIUM-NICKEL-MOLYBDENUM STEELS
COBALT ALLOYS
COPPER
CORROSION RESISTANT ALLOYS
CRYSTAL STRUCTURE
ELECTRON MICROSCOPY
ELECTRONIC CIRCUITS
ELEMENTAL MINERALS
ELEMENTS
FABRICATION
FATIGUE
GOLD
GRAPHITE
HEAT RES
HIGH ALLOY STEELS
INDIUM ALLOYS
INDIUM BASE ALLOYS
IRON ALLOYS
IRON BASE ALLOYS
JOINING
JOINTS
KOVAR
LEAD ALLOYS
LEAD BASE ALLOYS
MANGANESE
MANGANESE ADDITIONS
MANGANESE ALLOYS
MECHANICAL PROPERTIES
METALLOGRAPHY
METALS
MICROSCOPY
MICROSTRUCTURE
MINERALS
MOLYBDENUM
MOLYBDENUM ALLOYS
NICKEL
NICKEL ALLOYS
NONMETALS
OXIDES
OXYGEN COMPOUNDS
PRINTED CIRCUITS
SCANNING ELECTRON MICROSCOPY
SEMICONDUCTOR DEVICES
SOLDERED JOINTS
SOLDERING
STAINLESS STEEL-316L
STAINLESS STEELS
STEEL-CR17NI12MO3-L
STEELS
SURFACES
THERMAL FATIGUE
TIN ALLOYS
TIN BASE ALLOYS
TRANSISTORS
TRANSITION ELEMENTS
TRANSMISSION ELECTRON MICROSCOPY
WELDED JOINTS
WELDING