Microstructural characterization of solders and brazes for advanced packaging technology
Historically, the electronics industry has always attempted to increase the speed of electronic components and decrease the size of electronic assemblies by developing and manufacturing smaller and faster basic level components (e.g., integrated circuits). However, it is now becoming apparent that the next significant advancement in electronic assembly size and speed may come not as a result of smaller and faster devices, but rather as a consequence of smaller and more closely spaced packages. This increased packaging density will occur at early levels of assembly as industry moves towards multichip modules. It will also occur at later packaging steps as industry continues to expand the use of surface mount technology (SMT) and mixed mounting technology (through hole attachment as well as SMT on one circuit board). Furthermore, there will be an increased propensity to use higher packaging density on printed wiring boards (PWB) and to place more PWB's in a given volume at yet the next level of packaging. One class of materials on which this advanced packaging technology will place severe new demands will be the alloys used to join assemblies and subassemblies (e.g. solders and brazes). These materials will be taxed both from the perspective of enhanced manufacturability as well as greater in-service robustness. It is the objective of this paper, through the use of selected case studies, to illustrate how advanced microstructural characterization techniques can be used to improve packaging technology. The specific case studies discussed are: (1) Microstructural Characterization of Solders, (2) Microstructural Characterization of Solder Joint Embrittlement of Leaded, Surface Mount Transistors (3) Microstructural Characterization of Metal/Ceramic Brazes in Electronic Applications, and (4) Microstructural Characterization of Direct Brazing of Graphite to Copper. 25 refs., 16 figs.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (USA)
- Sponsoring Organization:
- USDOE; USDOE, Washington, DC (USA)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 5533596
- Report Number(s):
- SAND-91-0698C; CONF-910870-13; CONF-910872-5; ON: DE91011503
- Resource Relation:
- Conference: 49. Electron Microscopy Society of America (EMSA) annual meeting; 25. annual Microbeam Analysis Society meeting, San Jose, CA (USA); San Jose, CA (USA), 4-9 Aug 1991; 4-9 Aug 1991
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
42 ENGINEERING
BRAZED JOINTS
MICROSTRUCTURE
SOLDERED JOINTS
ALUMINIUM OXIDES
BRAZING
CERAMICS
COPPER
GOLD
GRAPHITE
INDIUM BASE ALLOYS
KOVAR
LEAD BASE ALLOYS
MANGANESE
METALLOGRAPHY
MOLYBDENUM
NICKEL
PRINTED CIRCUITS
SCANNING ELECTRON MICROSCOPY
SOLDERING
STAINLESS STEEL-316L
SURFACES
THERMAL FATIGUE
TIN BASE ALLOYS
TRANSISTORS
TRANSMISSION ELECTRON MICROSCOPY
ALLOYS
ALUMINIUM COMPOUNDS
AUSTENITIC STEELS
CARBON
CHALCOGENIDES
CHROMIUM ALLOYS
CHROMIUM-NICKEL STEELS
CHROMIUM-NICKEL-MOLYBDENUM STEELS
COBALT ALLOYS
CORROSION RESISTANT ALLOYS
CRYSTAL STRUCTURE
ELECTRON MICROSCOPY
ELECTRONIC CIRCUITS
ELEMENTAL MINERALS
ELEMENTS
FABRICATION
FATIGUE
HEAT RES
HIGH ALLOY STEELS
INDIUM ALLOYS
IRON ALLOYS
IRON BASE ALLOYS
JOINING
JOINTS
LEAD ALLOYS
MANGANESE ADDITIONS
MANGANESE ALLOYS
MECHANICAL PROPERTIES
METALS
MICROSCOPY
MINERALS
MOLYBDENUM ALLOYS
NICKEL ALLOYS
NONMETALS
OXIDES
OXYGEN COMPOUNDS
SEMICONDUCTOR DEVICES
STAINLESS STEELS
STEEL-CR17NI12MO3-L
STEELS
TIN ALLOYS
TRANSITION ELEMENTS
WELDED JOINTS
WELDING
360102* - Metals & Alloys- Structure & Phase Studies
426000 - Engineering- Components
Electron Devices & Circuits- (1990-)
360101 - Metals & Alloys- Preparation & Fabrication