Parametric study on the solderability of etched PWB copper

Technical Report · Tue Oct 01 00:00:00 EDT 1996

DOI:https://doi.org/10.2172/383632· OSTI ID:383632

Hosking, F M; Stevenson, J O; Hernandez, C L

The rapid advancement of interconnect technology has resulted in a more engineered approach to designing and fabricating printed wiring board (PWB) surface features. Recent research at Sandia National Laboratories has demonstrated the importance of surface roughness on solder flow. This paper describes how chemical etching was used to enhance the solderability of surfaces that were normally difficult to wet. The effects of circuit geometry, etch concentration, and etching time on solder flow are discussed. Surface roughness and solder flow data are presented. The results clearly demonstrate the importance of surface roughness on the solderability of fine PWB surface mount features.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 383632
• Report Number(s): SAND--96-2151C; CONF-9609212--3; ON: DE96014501; CRN: C/SNL--SC9101030B
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
42 ENGINEERING
COPPER
ETCHING
EXPERIMENTAL DATA
FABRICATION
PARAMETRIC ANALYSIS
PRINTED CIRCUITS
SOLDERING
WETTABILITY