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Title: Toughened moderate-temperature cure exoxy structural adhesives

Conference ·
OSTI ID:5525579

Low-viscosity liquid precursor adhesives that can be cured at mederate temperatures and deliver high static strength and fracture toughness in bonded joints are of interest in a variety of structural joining applications at Lawrence Livermore. We have developed a toughened, structural epoxy adhesive that cures completely at 75{degrees}C and has a fracture toughness, K{sub Ic}(joint)=1.3 MPa{radical}m, in a 100{mu}m thick bondline. This adhesive is based on diglycidylether of bisphenol-A (DGEBA) epoxide resin in combination with an amidoamine hardener, and is toughened with an epoxide-functional liquid rubber. This adhesive was developed to join beryllium oxide components, but has proven to be a good general purpose structural adhesive for a variety of high surface energy substrates including metals, metal oxide ceramics, and glasses. The low surface tension of the liquid adhesive, {gamma}=31 dynes/cm, ensures that it also will wet and bond most low surface energy solids such as plastics and fiber reinforced polymer composites.

Research Organization:
Lawrence Livermore National Lab., CA (United States)
Sponsoring Organization:
USDOE; USDOE, Washington, DC (United States)
DOE Contract Number:
W-7405-ENG-48
OSTI ID:
5525579
Report Number(s):
UCRL-JC-107317; CONF-9205146-1; ON: DE92011962
Resource Relation:
Conference: 6. international symposium on structural adhesive bonding, Morristown, NJ (United States), 4-7 May 1992
Country of Publication:
United States
Language:
English