Toughened moderate-temperature cure exoxy structural adhesives
Low-viscosity liquid precursor adhesives that can be cured at mederate temperatures and deliver high static strength and fracture toughness in bonded joints are of interest in a variety of structural joining applications at Lawrence Livermore. We have developed a toughened, structural epoxy adhesive that cures completely at 75{degrees}C and has a fracture toughness, K{sub Ic}(joint)=1.3 MPa{radical}m, in a 100{mu}m thick bondline. This adhesive is based on diglycidylether of bisphenol-A (DGEBA) epoxide resin in combination with an amidoamine hardener, and is toughened with an epoxide-functional liquid rubber. This adhesive was developed to join beryllium oxide components, but has proven to be a good general purpose structural adhesive for a variety of high surface energy substrates including metals, metal oxide ceramics, and glasses. The low surface tension of the liquid adhesive, {gamma}=31 dynes/cm, ensures that it also will wet and bond most low surface energy solids such as plastics and fiber reinforced polymer composites.
- Research Organization:
- Lawrence Livermore National Lab., CA (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 10141245
- Report Number(s):
- UCRL-JC-107317; CONF-9205146-1; ON: DE92011962
- Resource Relation:
- Conference: 6. international symposium on structural adhesive bonding,Morristown, NJ (United States),4-7 May 1992; Other Information: PBD: Mar 1992
- Country of Publication:
- United States
- Language:
- English
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