Toughened moderate-temperature cure exoxy structural adhesives

Conference · Sun Mar 01 04:00:00 EST 1992

OSTI ID:10141245

LeMay, J D; Lyon, R E

Low-viscosity liquid precursor adhesives that can be cured at mederate temperatures and deliver high static strength and fracture toughness in bonded joints are of interest in a variety of structural joining applications at Lawrence Livermore. We have developed a toughened, structural epoxy adhesive that cures completely at 75{degrees}C and has a fracture toughness, K{sub Ic}(joint)=1.3 MPa{radical}m, in a 100{mu}m thick bondline. This adhesive is based on diglycidylether of bisphenol-A (DGEBA) epoxide resin in combination with an amidoamine hardener, and is toughened with an epoxide-functional liquid rubber. This adhesive was developed to join beryllium oxide components, but has proven to be a good general purpose structural adhesive for a variety of high surface energy substrates including metals, metal oxide ceramics, and glasses. The low surface tension of the liquid adhesive, {gamma}=31 dynes/cm, ensures that it also will wet and bond most low surface energy solids such as plastics and fiber reinforced polymer composites.

• Research Organization: Lawrence Livermore National Lab., CA (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: W-7405-ENG-48
• OSTI ID: 10141245
• Report Number(s): UCRL-JC--107317; CONF-9205146--1; ON: DE92011962
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360201
360603
ADHESIVES
BERYLLIUM OXIDES
CURING
EPOXIDES
FRACTURE PROPERTIES
JOINING
MECHANICAL PROPERTIES
PREPARATION AND FABRICATION
RESINS