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Positron annihilation at the Si/SiO sub 2 interface

Journal Article · · Journal of Applied Physics; (United States)
DOI:https://doi.org/10.1063/1.350694· OSTI ID:5504947
 [1];  [2]; ;  [1];  [2];  [1]
  1. Brookhaven National Laboratory, Upton, New York 11973 (United States)
  2. IBM Research Division, T. J. Watson Research Center, Yorktown Heights, New York 10598 (United States)

Variable-energy positron annihilation depth-profiling has been applied to the study of the Si/SiO{sub 2} interface in Al-gate metal-oxide-semiconductor (MOS) structures. For both {ital n}- and {ital p}-type silicon under conditions of negative gate bias, the positron annihilation {ital S}-factor characteristic of the interface ({ital S}{sub int}) is substantially modified. Temperature and annealing behavior, combined with known MOS physics, suggest strongly that {ital S}{sub int} depends directly on holes at interface states or traps at the Si/SiO{sub 2} interface.

DOE Contract Number:
AC02-76CH00016
OSTI ID:
5504947
Journal Information:
Journal of Applied Physics; (United States), Journal Name: Journal of Applied Physics; (United States) Vol. 71:1; ISSN 0021-8979; ISSN JAPIA
Country of Publication:
United States
Language:
English

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