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Effects of hydrogen chloride on boron acceptor hydrogenation and trap generation-annealing in oxidized silicon irradiated by keV electrons

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.340154· OSTI ID:5389039

The effects of hydrogen chloride (HCl) during oxidation of silicon on the hydrogenation of boron acceptors and generation-annealing of interface and oxide traps are reported in 8-keV electron irradiated aluminum/polycrystalline-silicon/oxide/silicon capacitors. This paper shows (i) boron acceptor hydrogenation also occurs during HCl oxidation, a new finding, (ii) boron acceptor hydrogenation continues after the electron beam was turned off, (iii) interfacial chlorine reduces hydrogen migration to the silicon surface layer, a result also previously observed in capacitors stressed by avalanche injected electrons, and (iv) HCl oxidation significantly reduces the generated and annealed densities of interface and oxide traps by the 8-keV electrons but increases their annealing rate at room temperatures.

Research Organization:
Solid State Electronics Laboratory, Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
OSTI ID:
5389039
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 63:9; ISSN JAPIA
Country of Publication:
United States
Language:
English