Encapsulants for electronic components
Sandia National Laboratories has been developing the technology of encapsulating electronic components for over 30 years. During this time our laboratory has developed a number of encapsulating formulations that were tailored to withstand a variety of environments. Encapsulants are used to attenuate shock, match shock impedance, and provide superior mechanical and electrical properties. These rigid potting formulations range from unfilled to filled epoxies and polyurethane and polystyrene foams. These materials were developed not only to meet our design requirements but to provide highly reliable materials, thereby minimizing variability often encountered when using similar materials from an outside source. The intent of this paper is to describe briefly the evolution of these materials, their processing characteristics and physical properties based on a unique set of requirements.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (USA)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 5328158
- Report Number(s):
- SAND-85-2776C; CONF-861004-3; ON: DE86012852
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
CARBAMATES
CARBONIC ACID DERIVATIVES
CARBOXYLIC ACID SALTS
ELASTOMERS
ELECTRONIC CIRCUITS
ENCAPSULATION
EPOXIDES
MATERIALS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTICS
POLYMERS
POLYOLEFINS
POLYSTYRENE
POLYVINYLS
RUBBERS
SYNTHETIC MATERIALS
URETHANE