Mechanisms for enhanced packaging and/or burn-in total dose sensitivity in microelectronics
Conference
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OSTI ID:531074
- and others
The ionizing radiation response of several semiconductor process technologies has been shown to be enhanced by plastic packaging and/or pre-conditioning (burn-in). Potential mechanisms for this effect are discussed and data on bipolar linear circuits are presented.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 531074
- Report Number(s):
- SAND--97-0603C; CONF-970934--2; ON: DE97003730
- Country of Publication:
- United States
- Language:
- English
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