Photoresist dip coating on thin film networks. Final report
Application of liquid photoresist by dip coating was investigated as potentially more reliable and repeatable than the current roller coating process. Resist viscosity, extraction rate, and substrate orientation were found to affect applied resist thickness and uniformity. The data accumulated in this effort will be used in future work to develop an improved photoresist application process.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5259602
- Report Number(s):
- BDX-613-2398
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
360201* -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
ALUMINIUM COMPOUNDS
ALUMINIUM OXIDES
CHALCOGENIDES
DEPOSITION
DIMENSIONS
DIP COATING
ELECTRICAL EQUIPMENT
EQUIPMENT
FILMS
ORIENTATION
OXIDES
OXYGEN COMPOUNDS
RESISTORS
SUBSTRATES
SURFACE COATING
THICKNESS
VISCOSITY
360201* -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
ALUMINIUM COMPOUNDS
ALUMINIUM OXIDES
CHALCOGENIDES
DEPOSITION
DIMENSIONS
DIP COATING
ELECTRICAL EQUIPMENT
EQUIPMENT
FILMS
ORIENTATION
OXIDES
OXYGEN COMPOUNDS
RESISTORS
SUBSTRATES
SURFACE COATING
THICKNESS
VISCOSITY