Magnetically attached sputter targets
Patent
·
OSTI ID:5213946
An improved method and assembly for attaching sputtering targets to cathode assemblies of sputtering systems which includes a magnetically permeable material is described. The magnetically permeable material is imbedded in a target base that is brazed, welded, or soldered to the sputter target, or is mechanically retained in the target material. Target attachment to the cathode is achieved by virtue of the permanent magnets and/or the pole pieces in the cathode assembly that create magnetic flux lines adjacent to the backing plate, which strongly attract the magnetically permeable material in the target assembly. 11 figures.
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- Univ. of California, Oakland, CA ()
- Patent Number(s):
- A; US 5286361
- Application Number:
- PPN: US 7-962657
- OSTI ID:
- 5213946
- Country of Publication:
- United States
- Language:
- English
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