Magnetically attached sputter targets

Patent · Tue Feb 15 00:00:00 EST 1994

OSTI ID:5213946

Makowiecki, D M; McKernan, M A

An improved method and assembly for attaching sputtering targets to cathode assemblies of sputtering systems which includes a magnetically permeable material is described. The magnetically permeable material is imbedded in a target base that is brazed, welded, or soldered to the sputter target, or is mechanically retained in the target material. Target attachment to the cathode is achieved by virtue of the permanent magnets and/or the pole pieces in the cathode assembly that create magnetic flux lines adjacent to the backing plate, which strongly attract the magnetically permeable material in the target assembly. 11 figures.

• DOE Contract Number: W-7405-ENG-48
• Assignee: Univ. of California, Oakland, CA ()
• Patent Number(s): US 5286361; A
• Application Number: PPN: US 7-962657
• OSTI ID: 5213946
• Resource Relation: Patent File Date: 19 Oct 1992
• Country of Publication: United States
• Language: English

Related Subjects

71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
Ta
CATHODE SPUTTERING
TARGETS
DESIGN
MAGNETIC FLUX
MAGNETIC MATERIALS
MATERIALS
SPUTTERING
661220* - Particle Beam Production & Handling
Targets- (1992-)