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1/[ital f] noise and oxide traps in MOSFETS

Conference · · AIP Conference Proceedings (American Institute of Physics); (United States)
DOI:https://doi.org/10.1063/1.44691· OSTI ID:5188847
;  [1];  [2]
  1. Sandia National Laboratories, Dept. 1332, Albuquerque, New Mexico 87185-5800 (United States)
  2. Oberlin College, Physics Department, Oberlin, Ohio 44074 (United States)

Comparative studies of the 1/[ital f] noise and radiation response of MOS transistors strongly suggest that similar point defects are responsible for their 1/[ital f] noise and radiation-induced oxide-trap charge buildup. A prime candidate for this common defect has been identified in radiation effects studies as an E[prime] (E-prime) center, which is a trivalent Si center in SiO[sub 2] associated with a simple oxygen vacancy. Thus, methods to reduce the number of vacancies in the SiO[sub 2] layer of MOS technologies can dramatically reduce the 1/[ital f] noise of irradiated or [ital unirradiated] MOS devices MOSFETs built with radiation-hardened process techniques show 1/[ital f] noise levels approaching the low levels of JFETs. 1/[ital f] noise measurements can also be used to [ital predict] the oxide-trap charge buildup in MOS electronics in radiation environments, such as those encountered in many military, nuclear reactor, high-energy accelerator, and satellite and spacecraft environments. Using radiation-hardened'' circuits and devices in these applications can dramatically improve the performance of analog MOS electronics.

DOE Contract Number:
AC04-76DP00789
OSTI ID:
5188847
Report Number(s):
CONF-930866--
Journal Information:
AIP Conference Proceedings (American Institute of Physics); (United States), Journal Name: AIP Conference Proceedings (American Institute of Physics); (United States) Vol. 285:1; ISSN 0094-243X; ISSN APCPCS
Country of Publication:
United States
Language:
English