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Investigation of cosputtered W--C thin films as diffusion barriers

Journal Article · · J. Vac. Sci. Technol., A; (United States)
DOI:https://doi.org/10.1116/1.575301· OSTI ID:5132006
Polycrystalline thin films of W--C were deposited on single-crystal <111>Si or SiO/sub 2/ substrates by rf planar magnetron cosputtering of graphite (C) and W targets. The performance of cosputtered W/sub 75/C/sub 25/ thin films as diffusion barriers between a <111>Si substrate and metallic overlayers of Ag, Au, or Al was investigated. Backscattering spectrometry and x-ray diffraction are used to detect metallurgical interactions. Four-point probe measurement of resistance is employed to monitor the electrical stability of the metallization schemes upon thermal annealing in a vacuum for 30 min in temperature ranges from 500 to 700 /sup 0/C. The electrical resistivity of W/sub 75/C/sub 25/ films is 140 ..mu cap omega.. cm. A W/sub 75/C/sub 25/ layer 1100 A thick prevents metallurgical interdiffusion and reaction between Au or Ag overlayers and the <111>Si substrates up to 700 /sup 0/C, and between an Al overlayer and the <111>Si substrate up to 450 /sup 0/C.tential
Research Organization:
California Institute of Technology, Pasadena, California 91125
OSTI ID:
5132006
Journal Information:
J. Vac. Sci. Technol., A; (United States), Journal Name: J. Vac. Sci. Technol., A; (United States) Vol. 6:3; ISSN JVTAD
Country of Publication:
United States
Language:
English