Boiling heat transfer of a liquid film formed in the evaporator of a two-phase closed thermosiphon. Part 2

Journal Article · Sun Dec 31 23:00:00 EST 1989 · Heat Transfer - Japanese Research; (United States)

OSTI ID:5116399

Ouchi, M; Izumi, M; Yamakawa, N ^[1]; Saka, M ^[2]; Takeyama, T ^[3]

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1. Faculty of Engineering, Iwate Univ. (JP)
2. Nippon Gennen Service Co., Ltd. (JP)
3. Faculty of Engineering, Tohoku Univ. (JP)

The boiling heat transfer and the liquid film breakout occurring on the surface of the evaporator of a thermosiphone-type heat pipe are considered in this paper. The inside of the evaporator of the thermosiphone was simulated to observe these phenomena: the liquid film occurring on the surface was heated, initiating nucleate boiling in the liquid film. As a result, liquid film occurred; however, to stabilize the nucleate boiling, different surface structures were used. It was found that for grooved and meshed surfaces, the liquid film was preserved and at the same time the evaporation and the boiling heat transfer increased; however, dryout also increased.

• OSTI ID: 5116399
• Journal Information: Heat Transfer - Japanese Research; (United States), Journal Name: Heat Transfer - Japanese Research; (United States) Vol. 19:5; ISSN 0096-0802; ISSN HTJPA
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420400* -- Engineering-- Heat Transfer & Fluid Flow
BOILING
ENERGY TRANSFER
FLUID FLOW
FLUIDS
HEAT PIPES
HEAT TRANSFER
LIQUIDS
NUCLEATE BOILING
PHASE TRANSFORMATIONS
THERMOSYPHONS
TWO-PHASE FLOW