Alkaline cleaner replacement for printed wiring board fabrication

Technical Report · Mon Mar 31 23:00:00 EST 1997

DOI:https://doi.org/10.2172/481584· OSTI ID:481584

Goldammer, S E; Pemberton, S E; Tucker, D R

A replacement alkaline cleaning chemistry was qualified for the copper cleaning process used to support printed wiring board fabrication. The copper cleaning process was used to prepare copper surfaces for enhancing the adhesion of dry film photopolymers (photoresists and solder masks) and acrylic adhesives. The alkaline chemistry was used to remove organic contaminates such as fingerprints.

• Research Organization: Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 481584
• Report Number(s): KCP--613-5926; ON: DE97052934
• Country of Publication: United States
• Language: English

Related Subjects

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION
42 ENGINEERING
DETERGENTS
MANUFACTURING
ORGANIC COMPOUNDS
PERFORMANCE
PRINTED CIRCUITS
SURFACE CLEANING