Alkaline cleaner replacement for printed wiring board fabrication
A replacement alkaline cleaning chemistry was qualified for the copper cleaning process used to support printed wiring board fabrication. The copper cleaning process was used to prepare copper surfaces for enhancing the adhesion of dry film photopolymers (photoresists and solder masks) and acrylic adhesives. The alkaline chemistry was used to remove organic contaminates such as fingerprints.
- Research Organization:
- Allied-Signal Aerospace Co., Kansas City, MO (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 481584
- Report Number(s):
- KCP-613-5926; ON: DE97052934; TRN: AHC29712%%127
- Resource Relation:
- Other Information: PBD: Apr 1997
- Country of Publication:
- United States
- Language:
- English
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