Alkaline cleaner replacement for printed wiring board fabrication

Technical Report · Tue Apr 01 00:00:00 EST 1997

DOI:https://doi.org/10.2172/481584· OSTI ID:481584

Goldammer, S E; Pemberton, S E; Tucker, D R

A replacement alkaline cleaning chemistry was qualified for the copper cleaning process used to support printed wiring board fabrication. The copper cleaning process was used to prepare copper surfaces for enhancing the adhesion of dry film photopolymers (photoresists and solder masks) and acrylic adhesives. The alkaline chemistry was used to remove organic contaminates such as fingerprints.

• Research Organization: Allied-Signal Aerospace Co., Kansas City, MO (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 481584
• Report Number(s): KCP-613-5926; ON: DE97052934; TRN: AHC29712%%127
• Resource Relation: Other Information: PBD: Apr 1997
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES
32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION
PRINTED CIRCUITS
DETERGENTS
MANUFACTURING
SURFACE CLEANING
ORGANIC COMPOUNDS
PERFORMANCE