IONS SPUTTERED FROM COPPER

Journal Article · Thu Mar 01 04:00:00 EST 1962 · Journal of Applied Physics (U.S.)

DOI:https://doi.org/10.1063/1.1777185· OSTI ID:4802258

Bradley, R C; Ruedl, E

Positive ions sputtered from copper under a variety of bombardment and surface conditions are mass analyzed and found to include species characteristic of the incident ions, of copper and some of its compounds, and of alkali metal impurities. A model is described that accounts for most of the properties of the reflected'' ions, not in terms of reflection but in terms of the amount of gas trapped and released by the surface. The ionizing agent is unknown but is thought to be the bombarding ions (or their secondary electrons) rather than the surface. The Cu/sup +/ ions, on the other hand, seem to be surface-ionized sputtered particles originating from patches of high local work function. Yield data seem to correlate qualitatively with probable changes in work function caused by adsorption of impurities, sputtering, or vacuum annealing. The CuO/ sup+/ peak is believed to be caused by dissociation and ionization of cuprous oxide molecules under the action of the ion bombardment. The rates of formation and disappearance of this peak are studied under various circumstances. An unusually high sputtering rate is found to occur at an argon bombarding energy of 75 ev. Na and K impurities sputtered from and ionized by the copper surface showed transient effects that can be interpreted in terms of a low sputtering probability compared to the base metal. The relevance of these experiments to sputtering theories, ion pumping, oxidation, cleanup, and surface ionization theory is discussed. (auth)

• Research Organization: Cornell Univ., Ithaca, N.Y.
• Sponsoring Organization: USDOE
• NSA Number: NSA-16-013741
• OSTI ID: 4802258
• Journal Information: Journal of Applied Physics (U.S.), Journal Name: Journal of Applied Physics (U.S.) Vol. Vol: 33; ISSN JAPIA
• Country of Publication: Country unknown/Code not available
• Language: English

Related Subjects

ADSORPTION
ALKALI METALS
ANNEALING
ARGON
CLEANING
CONFIGURATION
COPPER
COPPER COMPOUNDS
COPPER OXIDES
DECOMPOSITION
ELECTRONICS
ELECTRONS
EMISSION
EV RANGE
GASES
IMPURITIES
ION BEAMS
IONIZATION
IONS
IRRADIATION
MASS
MASS SPECTROMETERS
MATHEMATICS
MEASURED VALUES
MOLECULES
OXIDATION
PHYSICS
POTASSIUM
REFLECTION
SCATTERING
SECONDARY EMISSION
SODIUM
SURFACES
THERMODYNAMICS
VACUUM
VARIATIONS
WORK FUNCTIONS