Microprobe study of diode corrosion
- Sandia National Labs., Albuquerque, NM (United States)
A few diodes from a production lot were discovered to have unacceptable current leak rates after about 5 years of storage. Inspection revealed the presence of copper sulfide deposits that bridged the external body of the diode and presumably provided a leakage path. Figure 1 shows the physical configuration of a diode. The function of this device is performed by a silicon-based semiconductor that is bonded between two cylinders of tungsten with copper headpins (Cu wire with a flat {open_quotes}nail-head{close_quotes} formed on one end) brazed to the opposite ends of the cylinders. A tropical ring of glass protects the Si chip. All exposed metal parts are covered by an immersion plating of Ag. Then the entire assembly is coated with black epoxy and a band of green ink is applied to the cathode end. During storage, each diode was placed in a cardboard holder and secured in stacks of about ten with rubber bands. Analytical and environmental exposure studies were performed at Allied Signal and Sandia to determine the cause and potential long-term significance of this corrosion product and help identify the corrosion mechanism.
- Research Organization:
- Sandia National Laboratory
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 468801
- Report Number(s):
- CONF-960877--
- Country of Publication:
- United States
- Language:
- English
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