Effects of mechanical properties of metal films on the adhesion strength of Cr/polyimide interfaces

Book · Thu May 01 04:00:00 EDT 1997

OSTI ID:467590

Choi, J W; Oh, T S ^[1]

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1. Hong Ik Univ., Seoul (Korea, Republic of). Dept. of Metallurgy and Materials Science

Thin film packaging is one of the key technologies to develop advanced electronic systems such as computers and telecommunication systems. Effects of mechanical properties of Cu/Cr metal films on the peel strength of Cr/PI interfaces have been studied. Cr and Cu thin films were successively sputter-deposited on in-situ RF plasma-treated polyimides, and 20 {micro}m-thick Cu was electroplated. With increasing the yield strength of Cu/Cr films from 156 MPa to 325 MPa, peel strength of Cr/PMDA-ODA and Cr/BPDA-PDA were lowered from 75 g/mm to 57 g/mm and from 69 g/mm to 20 g/mm, respectively. With identical Cu/Cr metal films, lower peel strength was obtained on Cr/BPDA-PDA interfaces, compared to the values of Cr/PMDA-ODA. Peel strength was also decreased more pronouncedly on Cr/BPDA-PDA with increasing the yield strength of Cu/Cr metal films. With T/H (80 C/94% R.H.) exposure, however, peel strength was lowered much more pronouncedly on Cr/PMDA-ODA than on Cr/BPDA-PDA, especially for specimens with Cu/Cr metal films of lower yield strength.

• Sponsoring Organization: Korea Science and Engineering Foundation (Korea, Republic of)
• OSTI ID: 467590
• Report Number(s): CONF-960401--; ISBN 1-55899-339-8
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
42 ENGINEERING
ADHESION
CHROMIUM
COMPOSITE MATERIALS
COPPER
ELECTRONIC EQUIPMENT
ELECTROPLATING
EXPERIMENTAL DATA
IMIDES
INTERFACES
LAYERS
MECHANICAL PROPERTIES
POLYMERS
SPUTTERING
THIN FILMS
YIELD STRENGTH