Microscratch analysis of the adhesion failure on oxide thin films with different thickness

Book · Thu May 01 04:00:00 EDT 1997

OSTI ID:467588

Ottermann, C R; Bange, K ^[1]; Braband, A; Haefke, H ^[2]; Gutmannsbauer, W ^[3]

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1. Schott Glaswerke, Mainz (Germany)
2. CSEM Swiss Center for Electronics and Microtechnology, Inc., Neuchatel (Switzerland)
3. Univ. of Basel (Switzerland). Inst. of Physics

Adhesion failures of TiO{sub 2} and Ta{sub 2}O{sub 5} thin films deposited by reactive evaporation (RE), reactive ion plating (IP) and plasma impulse chemical vapor deposition (PICVD) on fused silica, AF 45, TEMPAX and soda-lime glass substrates are investigated by means of a micro-scratch tester. The oxide films possess thickness between 60 and 500 nm and show different mass densities depending on the deposition conditions. Scratch testing exhibits well pronounced detachment for thicker films on hard substrates. The clearance of the scratch signal is reduced with decreasing layer thickness or for softer substrate materials. The test results are also influenced by the various substrates and different chemical and mechanical properties of the films due to the alternate deposition techniques.

• OSTI ID: 467588
• Report Number(s): CONF-960401--; ISBN 1-55899-339-8
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ADHESION
CHEMICAL VAPOR DEPOSITION
EXPERIMENTAL DATA
GLASS
MECHANICAL PROPERTIES
STRESSES
SUBSTRATES
SURFACE COATING
TANTALUM OXIDES
THIN FILMS
TITANIUM OXIDES
VAPOR PLATING
YOUNG MODULUS