Effect of in and out of plane stresses during indentation of diamond films on metal substrates
Book
·
OSTI ID:467585
- Univ. of Minnesota, MN (United States). Chemical Engineering and Materials Science
Diamond films grown on molybdenum substrates are indented with conical diamond indenters to depths more than 5 times the thickness of the film. This causes delamination and spalling of the film. The effects of variations in indenter angle and film thickness are demonstrated. Using a radius of the delaminated area to the residual contact radius, sharper indenters are shown to cause a 10 to 20% change in that ratio. For films greater than 5 {micro}m thick, there is no apparent film thickness effect. Possibilities for this observation are cracking due to bending stresses or the interfacial crack kinking out of the interface to a reduction in compressive stresses, leading to mixed mode loading. The strain energy release rate of the interface for an 800 nm diamond film on molybdenum is between 2.4 and 7 J/m{sup 2}.
- OSTI ID:
- 467585
- Report Number(s):
- CONF-960401--; ISBN 1-55899-339-8
- Country of Publication:
- United States
- Language:
- English
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