Indentation technique to measure the fraction toughness of thin-film/substrate interfaces
Technical Report
·
OSTI ID:5948030
An indentation technique employing a conventional microhardness tester is developed and used to study the adherence of the interface of zinc oxide thin films to silicon substrates. Upon unloading of a Vickers diamond indenter, lateral cracks propagate parallel to the film surface, either along the interface or within the film. A fracture mechanics model is proposed which relates the adherence in the presence of interface cracking to the interface crack length, the indentation load, the geometry of the indenter, the material parameters of the film and the residual stress in the film. The model also predicts the spalling behavior of the film as a function of the interface toughness. Based on the proposed model, the fraction toughness of a ZnO/Si interface is measured. 22 figures, 2 tables.
- Research Organization:
- Lawrence Berkeley Lab., CA (USA)
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 5948030
- Report Number(s):
- LBL-15892; ON: DE83015959
- Country of Publication:
- United States
- Language:
- English
Similar Records
Effects of thin compressive films on indentation fracture toughness measurements
Effect of in and out of plane stresses during indentation of diamond films on metal substrates
Comparison of indentation crack resistance and fracture toughness of five WC--Co alloys
Technical Report
·
Thu Dec 31 23:00:00 EST 1987
·
OSTI ID:7172536
Effect of in and out of plane stresses during indentation of diamond films on metal substrates
Book
·
Thu May 01 00:00:00 EDT 1997
·
OSTI ID:467585
Comparison of indentation crack resistance and fracture toughness of five WC--Co alloys
Journal Article
·
Mon May 01 00:00:00 EDT 1978
· Metall. Trans., A; (United States)
·
OSTI ID:6515984