Suppression of self-interstitials in silicon during ion implantation via in-situ photoexcitation
- North Carolina State Univ., Raleigh, NC (United States). Dept. of Materials Science and Engineering
- Univ. of North Carolina, Chapel Hill, NC (United States). Dept. of Physics and Astronomy
- Oak Ridge National Labs., TN (United States). Solid State Div.
The influence of in-situ photoexcitation during low temperature implantation on self-interstitial agglomeration following annealing has been investigated using transmission electron microscopy (TEM). A reduction in the level of as-implanted damage determined by RBS and TEM occurs athermally during 150 keV self-ion implantation. The damage reduction following a 300 C anneal suggests that it is mostly divacancy related. Subsequent thermal annealing at 800 C resulted in the formation of (311) rod like defects or dislocation loops for samples with and without in-situ photoexcitation, respectively. Estimation of the number of self-interstitials bound by these defects in the sample without in-situ photoexcitation corresponds to the implanted dose; whereas for the in-situ photoexcitation sample a suppression of {approx}2 orders in magnitude is found. The kinetics of the athermal annealing process are discussed within the framework of either a recombination enhanced defect reaction mechanism, or a charge state enhanced defect migration and Coulomb interaction.
- Research Organization:
- Oak Ridge National Lab., TN (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States); National Science Foundation, Washington, DC (United States)
- DOE Contract Number:
- AC05-84OR21400
- OSTI ID:
- 46696
- Report Number(s):
- CONF-941144--119; ON: DE95009173; CNN: Grant DMR-9215538
- Country of Publication:
- United States
- Language:
- English
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