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Interactions of ion-implantation-induced interstitials with boron at high concentrations in silicon

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.117441· OSTI ID:286890
 [1]; ; ; ; ;  [2]
  1. Solid State Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831 (United States)
  2. Bell Laboratories, Lucent Technologies, Murray Hill, New Jersey 07974 (United States)
Ion implantation of Si (60 keV, 1{times}10{sup 14}/cm{sup 2}) has been used to introduce excess interstitials into silicon predoped with high background concentrations of B, which were varied between 1{times}10{sup 18} and 1{times}10{sup 19}/cm{sup 3}. Following post-implantation annealing at 740{degree}C for 15 min to allow agglomeration of the available interstitials into elongated {l_brace}311{r_brace} defects, the density of the agglomerated interstitials was determined by plan-view transmission electron microscopy observation of the defects. We report a significant reduction in the fraction of excess interstitials trapped in {l_brace}311{r_brace} defects as a function of boron concentration, up to nearly complete disappearance of the {l_brace}311{r_brace} defects at boron concentrations of 1{times}10{sup 19}/cm{sup 3}. The reduction of the excess interstitial concentration is interpreted in terms of boron-interstitial clustering, and implications for transient-enhanced diffusion of B at high concentrations are discussed. {copyright} {ital 1996 American Institute of Physics.}
Research Organization:
Oak Ridge National Laboratory
DOE Contract Number:
AC05-96OR22464
OSTI ID:
286890
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 10 Vol. 69; ISSN 0003-6951; ISSN APPLAB
Country of Publication:
United States
Language:
English

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