SOLID STATE DIFFUSION BONDING OF REFRACTORY METALS AND ALLOYS

Technical Report · Wed Aug 01 00:00:00 EDT 1962

DOI:https://doi.org/10.2172/4634983· OSTI ID:4634983

Tarr, C. O.

Solid-state diffusion bonding of refractory metals by heating in vacuum was developed for self-bonding Cb to Cb, Mo to Mo, and bi-metal bonding Mo to Ta, etc. Other metals and alloys such as W, Re, Mo, Ta, Cb, V, W--26 Re, Mo-- 50 Re, and Ta-- 10 W have also been diffusion bonded. True metallurgical bonds are achieved at the contacting metal interfaces with only sufficient pressure to assure positioning and contact of the areas to be bonded. Grain boundary migration appears to be a major mechanism in forming the bonds. Stress-rupture tests at 4000 deg F on Mo and 4700 deg F on Ta-- 10 W alloy were conducted up to 10 hours in hydrogen atmosphere to permit comparison of diffusion-bonded joint rupture strength with basic thin sheet properties. (auth)

• Research Organization: General Electric Co. Advanced Technology Services, Cincinnati
• DOE Contract Number: AT(40-1)-2847
• NSA Number: NSA-17-036243
• OSTI ID: 4634983
• Report Number(s): CONF-53-8; TM-62-9-8
• Country of Publication: United States
• Language: English

Related Subjects

BONDING
DIFFUSION
FAILURES
GRAIN BOUNDARIES
HEATING
HIGH TEMPERATURE
HYDROGEN
MATERIALS TESTING
METALS, CERAMICS, AND OTHER MATERIALS
MOLYBDENUM
MOLYBDENUM ALLOYS
NIOBIUM
PRESSURE
REFRACTORIES
RHENIUM
RHENIUM ALLOYS
SHEETS
SOLIDS
STRESSES
SURFACES
TANTALUM ALLOYS
THICKNESS
TUNGSTEN
TUNGSTEN ALLOYS
VACUUM
VANADIUM