Characterization of polysulfone-epoxy/amine interphase for bonding themoplastic composites
- Univ. of Delaware, Newark, DE (United States)
Thermoplastic matrix composites offer several advantages over thermoset matrix composites such as higher interlaminar toughness and infinite shelf life and rapid manufacturing. However, traditional welding techniques for joining thermoplastics require intimate contact between the components, localized heating at the interface and moderate consolidation pressure. Assembly tolerances represent a challenge in scaling welding techniques to large structures where any gaps in the bondline may result in overheating and poor joint quality and performance. Thermoset adhesives offer a low pressure solution to fill gaps. However joining thermoplastic composite components with structural thermoset adhesives often requires elaborate surface treatment of the thermoplastic composite adherents. These surface treatments have several limitations in production environments including finite shelf life, cost, and possible restrictions on part size and shape. These limitations may potentially hinder the widespread use of these materials in structural applications. Other methods for enhancing the bond performance are available. Previous work at the authors` institution has shown that adhesion between thermoplastic composites and epoxy-based adhesives is improved in instances where polymer interdiffusion across the interface is suspected. The improved joint performance has been attributed to interfacial diffusion of the adhesive pre-polymers into the thermoplastic material during processing. Upon final cure, bonding is believed to be enhanced through entanglements between the thermoplastic polymer chains and the network structure of the adhesive. Optimization of this bonding process requires an understanding of the rate of diffusion of the adhesive prepolymers into the thermoplastic and the structure and properties of the interfacial region. This paper focuses on the diffusion study.
- OSTI ID:
- 441522
- Report Number(s):
- CONF-960214--
- Country of Publication:
- United States
- Language:
- English
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