CVD diamond substrate for microelectronics. Final report

Technical Report · Fri Nov 01 04:00:00 EST 1996

DOI:https://doi.org/10.2172/436418· OSTI ID:436418

Burden, J ^[1]; Gat, R ^[2]

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1. Allied Signal, Inc., Kansas City, MO (United States). Federal Mfg. and Technologies
2. Applied Science and Technology, Inc., Woburn, MA (United States)

Chemical Vapor Deposition (CVD) of diamond films has evolved dramatically in recent years, and commercial opportunities for diamond substrates in thermal management applications are promising. The objective of this technology transfer initiative (TTI) is for Applied Science and Technology, Inc. (ASTEX) and AlliedSignal Federal Manufacturing and Technologies (FM&T) to jointly develop and document the manufacturing processes and procedures required for the fabrication of multichip module circuits using CVD diamond substrates, with the major emphasis of the project concentrating on lapping/polishing prior to metallization. ASTEX would provide diamond films for the study, and FM&T would use its experience in lapping, polishing, and substrate metallization to perform secondary processing on the parts. The primary goal of the project was to establish manufacturing processes that lower the manufacturing cost sufficiently to enable broad commercialization of the technology.

• Research Organization: Allied Signal, Inc., Kansas City, MO (United States). Federal Mfg. and Technologies
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 436418
• Report Number(s): KCP--613-5859; ON: DE97051085
• Country of Publication: United States
• Language: English

Related Subjects

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION
42 ENGINEERING
CHEMICAL VAPOR DEPOSITION
COMMERCIALIZATION
DIAMONDS
FABRICATION
INTEGRATED CIRCUITS
POLISHING
PROGRESS REPORT
SUBSTRATES
TECHNOLOGY TRANSFER
THIN FILMS