Applications for precision cutting of sharpening CVD diamond film
Conference
·
OSTI ID:230043
- Tokyo Institute of Technology (Japan)
A thick CVD diamond has been expected to the applications for cutting tools. But it is difficult to sharpen thick CVD diamond films by means of a conventional sharpening method using diamond grinding wheel for forming a large chipping of scores of micrometers at the cutting edge. Accordingly, we have made a thermochemical polishing n apparatus capable of polishing a sharpening for cutting tool and thick CVD diamond films were processed by this apparatus. And then the cutting test by aluminum alloy was conducted and the cutting performance of thick CVD diamond films polished by thermochemical polishing method was evaluated.
- OSTI ID:
- 230043
- Report Number(s):
- CONF-950840-; TRN: 96:000433-0042
- Resource Relation:
- Conference: International conference on applications of diamond films and related materials, Gaithersburg, MD (United States), 21-24 Aug 1995; Other Information: PBD: 1995; Related Information: Is Part Of Applications of diamond films and related materials: Third international conference; Feldman, A.; Yarbrough, W.A.; Murakawa, Masao; Tzeng, Yonhua; Yoshikawa, Masanori [eds.]; PB: 973 p.
- Country of Publication:
- United States
- Language:
- English
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