Affected layer of polished single and CVD diamonds
Conference
·
OSTI ID:230051
- Tokyo Institute of Technology (Japan); and others
Both single and CVD diamonds were mechanically polished by using grinding wheels of No. 400 or No. 1500. The polished surfaces were smooth and no cracks could not be observed by a microscope. These surfaces were exposed in hydrogen plasma for 1 hour, cracks appeared on the surface. For the single crystal diamond, the crack shape exhibited the relation with crystallographic orientation of the polished surface and polishing direction. Also on the CVD diamond cracks came out by etching but the size is smaller than those on a single crystal diamond.
- OSTI ID:
- 230051
- Report Number(s):
- CONF-950840--
- Country of Publication:
- United States
- Language:
- English
Similar Records
Applications for precision cutting of sharpening CVD diamond film
Polishing of thick CVD diamond by an excimer laser and a cast iron wheel
Surface and subsurface cracks characteristics of single crystal SiC wafer in surface machining
Conference
·
Sat Dec 30 23:00:00 EST 1995
·
OSTI ID:230043
Polishing of thick CVD diamond by an excimer laser and a cast iron wheel
Conference
·
Sat Dec 30 23:00:00 EST 1995
·
OSTI ID:230052
Surface and subsurface cracks characteristics of single crystal SiC wafer in surface machining
Journal Article
·
Mon Mar 30 00:00:00 EDT 2015
· AIP Conference Proceedings
·
OSTI ID:22391334